Internship - Data Management for Package Development Digitalization

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Your Role
Key responsibilities in your new role
- 1. Assess and evaluate BE DEV top-focus digitalization project data requirements
- Conduct stakeholder interviews to elicit data needs and critical questions
- Translate business questions into data requirements and Critical Data Elements (CDEs) with clear definitions and quality expectations - 2. Map and categorize data sources and ownership per data domain
- Inventory internal systems and categorize data into domains
- Propose accountability by domain: data owners, data stewards; draft a RACI for each domain - 3. Jointly formulate Data Quality Business Rules (DQBR)
- Co-design rule sets across data quality dimensions: completeness, validity, accuracy, consistency, uniqueness, timeliness - 4. Draft policies and operating procedures
- Propose a data issue management workflow - 5. Cross-functional communication and change enablement
Internship Learning Outcomes:
- Understand data as a strategic enabler for digital transformation in semiconductor backend virtual IC development.
- Comprehend the semiconductor IC package development lifecycle (design rules, BOM, substrate, die attach, wire bond, molding, singulation, etc.) and its related data footprints.
- Grasp data governance components: domains, ownership, stewardship, policy, data quality, metadata, lineage, and issue management.
- Recognize how high-quality data accelerates digitalization, simulation credibility, yield improvement, and cycle-time reduction.
- Possible deliverables:
1. Data inventory and source-to-domain ownership matrix with RACI.
2. Catalog of critical data elements (CDE) prioritized by business impact and risk.
3. DQBR specification document with testable rules and thresholds per critical data element (CDE).
4. Draft policy and SOPs for stewardship, access, and issue management.
Your Profile
Qualifications and skills to help you succeed
- On track to attain Bachelor/Master in Electrical & Electronic Engineering, Computer Engineering or Information Systems Engineering.
- Required competencies:
1. Strong analytical skills; comfortable with data exploration using SQL or Python (or equivalent).
2. Ability to work independently with minimal supervision; proactive problem solving.
3. Willingness to learn semiconductor packaging processes and related data.
4. Clear written and verbal communication; ability to synthesize complex topics. - Preferred competencies:
1. Exposure to data governance concepts (data domains, data quality, stewardship) and data catalog tools.
2. Exposure to data management concepts, e.g. manufacturing/industrial data (MES/SPC) or PLM/engineering data.
3. Exposure to data quality frameworks and basic knowledge of statistics fo industrial applications. - Preferred internship period: March - Aug 26
#WeAreIn for driving decarbonization and digitalization.
As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener.
Are you in?
We are on a journey to create the best Infineon for everyone.
This means we embrace diversity and inclusion and welcome everyone for who they are. At Infineon, we offer a working environment characterized by trust, openness, respect and tolerance and are committed to give all applicants and employees equal opportunities. We base our recruiting decisions on the applicant´s experience and skills. Learn more about our various contact channels.
Please let your recruiter know if they need to pay special attention to something in order to enable your participation in the interview process.
Click here for more information about Diversity & Inclusion at Infineon.
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