Mechanical Design for Digital Integration – DCOE Intern

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Job Description Summary
As part of the development of digital offerings within the Digital Center of Excellence (DCOE), we are offering a technical internship focused on the design and implementation of solutions for integrating digital products into the mechanical operating mechanisms of Extra High Voltage (EHV) circuit breakers.These solutions aim to enhance equipment supervision, reliability, condition-based maintenance, and operational performance of high-voltage assets.
Internship Objectives
The intern will be involved in:
Studying the mechanical operating mechanisms of EHV circuit breakers and their operating principles
Analyzing requirements for the integration of sensors and digital solutions (e.g. displacement sensors, digital SF₆ gas sensors)
Mechanical / electromechanical design of integration solutions
Participating in the manufacturing, assembly, and testing of the developed solutions
Preparing technical documentation (calculation notes, drawings, procedures, test reports)
Interfacing with electrical, digital, and system engineering teams
Job Description
What you will do:
Conduct mechanical and electromechanical studies of operating mechanisms
Propose integration solutions compliant with EHV constraints (vibrations, environment, safety)
Support prototyping and validation phases
Assist in industrialization and standardization of solutions
Participate in DCOE technical reviews
What you will bring:
Final year student pursuing a Master’s or Engineering degree in Mechanical, Industrial or Electromechanical.
Proficiency in Computer-Aided Design (CAD).
Basic understanding of electrical systems.
Good level of French and English.
The internship duration is up to five months.
What will make you stand out:
Strong analytical and problem-solving skills
High level of autonomy, rigor, and self-motivation
Ability to work effectively in an international industrial environment
Good teamwork, collaboration, and communication skills
Interest in industrial systems and digital innovation
Additional Information
Relocation Assistance Provided: No
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