INTERNSHIP DETAILS

Thermal Engineering R&D Intern

CompanyAdvantest
LocationSan Jose
Work ModeOn Site
PostedJanuary 27, 2026
Internship Information
Core Responsibilities
The intern will perform thermal simulations and develop cooling strategies for advanced semiconductor packaging. They will also evaluate thermal interface materials and collaborate with engineers to ensure thermal solutions meet design requirements.
Internship Type
full time
Company Size
3731
Visa Sponsorship
No
Language
English
Working Hours
40 hours
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About The Company
Advantest (TSE: 6857) is the leading manufacturer of automatic test and measurement equipment used in the design and production of semiconductors for applications including 5G communications, the Internet of Things (IoT), autonomous vehicles, high performance computing (HPC) including artificial intelligence (AI) and machine learning, and more. Its leading-edge systems and products are integrated into the most advanced semiconductor production lines in the world. The company also conducts R&D to address emerging testing challenges and applications; develops advanced test-interface solutions for wafer sort and final test; produces scanning electron microscopes essential to photomask manufacturing; and offers system-level test solutions and other test-related accessories. Founded in Tokyo in 1954, Advantest is a global company with facilities around the world and an international commitment to sustainable practices and social responsibility. More information is available at www.advantest.com.
About the Role

Description:

Join our R&V team to support thermal design and simulation efforts for advanced semiconductor packaging test platforms. You may work on heat dissipation strategies and thermal modeling for PCBs, interposers, probe cards, and cooling solutions for the device under test.

Key Responsibilities:

Thermal Simulation & Analysis

·         Perform thermal simulations (Convection/Conduction-based, steady-state/transient) to estimate heat dissipation across PCBs, Interposers, Test Thermal assemblies and probe cards.

 

Cooling Strategy Development

·         Evaluate and propose cooling solutions (liquid cooling, heat sinks, air-cooled, zonal heaters) for advanced packaged devices.

 

Material & Interface Evaluation

·         Research thermal interface materials (TIMs) and their impact on heat transfer efficiency.

 

Documentation & Reporting

·         Prepare detailed thermal analysis reports and present findings in design reviews.

·         Maintain organized documentation for future reference.

 

Cross-functional Collaboration

·         Work closely with mechanical and electrical engineers to ensure thermal solutions align with fixture and test requirements.

Qualifications

Requirements:

  • Pursuing BS/MS in Mechanical Engineering, Thermal Engineering, or related field.
  • Strong fundamentals in heat transfer, thermodynamics
  • Experience with thermal simulation tools is a plus (Solidworks, ANSYS Icepak, or similar), focusing on both steady-state and transient analysis.
  • Familiarity with PCB design constraints and semiconductor packaging thermal challenges is a plus.
  • Excellent problem-solving and communication skills.

 

Additional Skills Preferred (but not required):

  • Familiarity with heaters, Peltiers, heatsinks, sockets, two-phase cooling, cryogenics, airflow uniformity, and condensation abatement.
  • Familiarity with programming languages such as Matlab and Python.

Experience in electronic packaging, automated handling, and integration of thermal systems is a plus.

 

NOTE: Benefits do NOT apply to interns.

Key Skills
Thermal SimulationHeat TransferThermodynamicsCooling SolutionsThermal Interface MaterialsDocumentationReportingProblem-SolvingCommunicationPCB DesignThermal ModelingCollaborationSolidworksANSYS IcepakMatlabPython
Categories
EngineeringScience & ResearchTechnology