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INTERNSHIP DETAILS

Intern, IC Packaging Thermal Analysis (Summer 2026)

CompanySK hynix America

LocationSan Jose

Work ModeOn Site

PostedFebruary 24, 2026

Internship Information

Core Responsibilities

The intern will gain hands-on experience in thermal modeling and characterization of advanced semiconductor packages, while being introduced to the basics of advanced package design and manufacturing processes. Responsibilities include learning numerical analysis tools, developing thermal FEA models to characterize performance, interpreting simulation results, and documenting findings clearly.

Internship Type

full time

Salary Range

$26 - $50

Company Size

346

Visa Sponsorship

Language

English

Working Hours

40 hours

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About The Company

Semiconductors are essential to all IT products, and its performance often determines the performance of the final products. SK hynix is a global leader in producing semiconductor, such as DRAM, NAND Flash and CMOS Image Sensors. With these technology driven semiconductor products, SK hynix has consistently led the industry and is now the second largest memory chip maker worldwide. IT devices become more pervasive as new imaginative and innovative IT products continue to grab imagination and desires of consumers. SK hynix has enhanced its competency with the best level of technology and a wide range of business portfolios in order to satisfy all those demand from customers. As a member of SK Group*, SK hynix is aiming at becoming the world’s best semiconductor company. SK hynix America Inc. operates as a subsidiary of SK Hynix Inc. *SK Group is one of South Korea's top five industrial conglomerates. It has about 40 affiliated companies, ranging from energy, telecommunications, finance, to construction.

About the Role

Job Title: Intern, IC Packaging Thermal Analysis (Summer 2026)

Office Location: San Jose, CA
Work Model: Onsite
Duration: June 2026 - August 2026

At SK hynix America, we're at the forefront of semiconductor innovation, developing advanced memory solutions that power everything from smartphones to data centers. As a global leader in DRAM and NAND flash technologies, we drive the evolution of advancing mobile technology, empowering cloud computing, and pioneering future technologies. Our cutting-edge memory technologies are essential in today's most advanced electronic devices and IT infrastructure, enabling enhanced performance and user experiences across the digital landscape.

We're looking for innovative minds to join our mission of shaping the future of technology. At SK hynix America, you'll be part of a team that's pioneering breakthrough memory solutions while maintaining a strong commitment to sustainability. We're not just adapting to technological change – we're driving it, with significant investments in artificial intelligence, machine learning, and eco-friendly solutions and operational practices. As we continue to expand our market presence and push the boundaries of what's possible in semiconductor technology, we invite you to be part of our journey to creating the next generation of memory solutions that will define the future of computing.

About the Role:

We are offering an exciting opportunity at SK Hynix USA for IC Packaging Thermal Analysis Intern to join our dynamic engineering team. In this position, you will work on advanced semiconductor packaging projects, gaining hands-on experience in thermal modeling and characterization of advanced packages. You will be introduced to the basics of the advanced package design and manufacturing process flow. This is a very exciting opportunity for a candidate aspiring to build up professional growth and be part of SK Hynix success.
Projects will be assigned to the intern(s): Advanced Memory & 3D Packaging Thermal Analysis

Responsibilities:

Become familiar with various IC packaging structures and the process steps involved in making the end product.
Learn the basics of using numerical analysis tools such as FloTHERM, Icepak etc.
Start developing thermal FEA models to characterize the package/system level thermal resistance and other thermal performance parameters.
Learn to interpret the thermal behavior of models and simulation results and correlate to observed behavior and measurements.
Document all simulation models, codes and scripts and present the results in simple and clear terms to a broader audience.

Qualifications And Education Requirements:

Currently pursuing a Master's or PhD's degree in Mechanical Engineering, Materials Science, or a related field.
Strong interest in heat transfer, finite element analysis and its applications in semiconductor packaging.
Strong problem-solving and analytical skills.
Excellent communication and teamwork abilities, with a desire to collaborate effectively in a multidisciplinary environment.

Preferred Skills

Currently pursuing a PhD's degree in Mechanical Engineering, Materials Science, or a related field.
Familiarity with FEA software (e.g., FloTHERM, Icepak) is a plus.
Basic understanding of semiconductor packaging concepts and materials is advantageous.

Housing Allowance:

Eligible interns will receive a housing allowance during their internship.

Equal Employment Opportunity:
SKHYA is an Equal Employment Opportunity Employer. We provide equal employment opportunities to all qualified applicants and employees, and prohibit discrimination and harassment of any type without regard to race, sex, pregnancy, sexual orientation, religion, age, gender identity, national origin, color, protected veteran or disability status, genetic information or any other status protected under federal, state, or local applicable laws.

Compensation:

Our compensation reflects the cost of labor across several U.S. geographic markets, and we pay differently based on those defined markets. Pay within the provided range varies by work location and may also depend on job-related skills and experience. Your Recruiter can share more about the specific salary range for the job location during the hiring process.

Pay Range

$26—$50 USD

Key Skills

Thermal ModelingCharacterizationFEAFloTHERMIcepakHeat TransferFinite Element AnalysisSemiconductor PackagingData AnalysisDocumentationCommunication