INTERNSHIP DETAILS

Mechanical Simulation Intern

CompanySTMicroelectronics
LocationEdinburgh
Work ModeOn Site
PostedMarch 13, 2026
Internship Information
Core Responsibilities
The role involves combining simulation with experimental measurements to analyze various semiconductor packages, focusing primarily on developing new modeling techniques and evaluating their effectiveness for future applications. Potential research topics include homogenized material property application in FEA and transient thermal response analysis.
Internship Type
full time
Company Size
35124
Visa Sponsorship
No
Language
English
Working Hours
40 hours
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About The Company
ST is a global semiconductor leader delivering intelligent and energy-efficient products and solutions that power the electronics at the heart of everyday life. ST’s products are found everywhere today, and together with our customers, we are enabling smarter driving and smarter factories, cities and homes, along with the next generation of mobile and Internet of Things devices. By getting more from technology to get more from life, ST stands for life.augmented.
About the Role

OUR STORY


At STMicroelectronics, we believe in the power of technology to drive innovation and make a positive impact on people, businesses, and society. As a global semiconductor company, our advanced technologies and chips form the hidden foundation of the world we live in today.


When you join ST, you will be part of a global business with more than 115 nationalities, present in 40 countries, and comprising over 50,000 diverse and dedicated creators and makers of technology around the world.


Developing technologies takes more than talent: it takes amazing people who understand collaboration and respect. People with passion and the desire to disrupt the status quo,  drive innovation, and unlock their own potential. 

Embark on a journey with us, where you can innovate for a future that we want to make smarter and greener, in a responsible and sustainable way. Our technology starts with you.

THE TEAM

The Mechanical Simulation Intern will join the Module and Optics Research and Development team which is part of the wider ST Imaging Division.

The group, which has expertise in optical, mechanical, and electrical disciplines, are responsible for designing precision opto-mechanical technologies, incorporating ST silicon sensors and optics to produce state-of-the-art optical and photonics devices. The products, such as time-of-flight laser sensors, ambient light sensors, and cameras, are designed for the consumer, mobile, industrial and automotive markets.

The devices are designed and developed in cooperation with other ST groups around the world and in partnership with suppliers and subcontractors. With a strong design emphasis on cost and industrialisation for very high volume, ST sensors are developed using state of the art materials, components, and precision automated assembly processes.
 

YOUR ROLE 

The role in the mechanical simulation team will entail combining simulation with experimental measurements to analyse different semiconductor packages. The successful applicant will primarily work on developing new modelling techniques and helping to evaluate their efficacy for future applications. Potential research topics may include, homogenised material property application in Finite element analysis (FEA), transient thermal response of a system in package (SIP), parameterised stress analysis of package structures.

FEA and thermal computational fluid dynamics (CFD) are performed using ANSYS commercial tools, augmented by Python and Excel for experimental data signal filtering and post processing. Code development in Python will be part of the role.

The role provides an opportunity to collaborate with engineers across multi-disciplinary teams, including mechanical designers, measurement analysts, and electrical systems engineers. The ideal candidate will have an analytical mindset with the confidence to take on challenging numerical tasks independently, as well as an inquisitive nature for open collaboration with other team members. 
 

YOUR SKILLS & EXPERIENCES

  • Working towards a Master’s degree in Mechanical Engineering. 
  • Ideally some experience in FEA, alternatively experience in using matrix methods for structural analysis. 
  • Candidate will have completed courses in; Solid mechanics with competence in analytical solutions, thermodynamics with good understanding of Fourier’s law of heat conduction, and material science of dielectrics (ceramics), metals, polymers.
  • Proven experience in using Python or MatLab.
  • CAD modelling experience ideal (any package). 
     

ST is proud to be one of the 17 companies certified as a 2025 Global Top Employer and the first and only semiconductor company to achieve this distinction. ST was recognized in this ranking thanks to its continuous improvement approach and stands out particularly in the areas of ethics & integrity, purpose & values, organization & change, business strategy, and performance.

At ST, we endeavor to foster a diverse and inclusive workplace, and we do not tolerate discrimination. We aim to recruit and retain a diverse workforce that reflects the societies around us. We strive for equity in career development, career opportunities, and equal remuneration. We encourage candidates who may not meet every single requirement to apply, as we appreciate diverse perspectives and provide opportunities for growth and learning. Diversity, equity, and inclusion (DEI) is woven into our company culture. 


To discover more, visit st.com/careers.

Key Skills
FEACFDPythonExcelANSYSSolid MechanicsThermodynamicsMaterial ScienceCAD ModellingMatrix MethodsStress AnalysisThermal ResponseSimulationExperimental MeasurementData Filtering
Categories
EngineeringScience & ResearchTechnologyManufacturing