INTERNSHIP DETAILS

Hardware Engineering Intern

CompanyIPG Photonics
LocationKingston
Work ModeOn Site
PostedMarch 16, 2026
Internship Information
Core Responsibilities
The intern will be responsible for creating and revising 3D models and 2D manufacturing drawings, as well as developing schematic drawings and circuit board layouts. Duties also include capturing and analyzing manufacturing process data and performing laboratory experiments on product subsystems.
Internship Type
int internship
Company Size
1862
Visa Sponsorship
No
Language
English
Working Hours
40 hours
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About The Company
IPG Photonics is the world leader in fiber laser technology, offering solutions for applications across a wide array of industries. Headquartered in Marlborough, USA, the company has developed a robust, vertically integrated supply chain, developing key technology components in-house, thus enabling the most reliable, powerful, and efficient laser solutions. With over 30 locations across the globe, we are committed to developing innovative products that provide reliable, cost-effective solutions for our customers’ needs.
About the Role

IPG Photonics is the world leader in high power fibre lasers for industrial welding, cleaning, and cutting equipment. Our Canadian subsidiary in Kingston, Ontario produces market-disrupting sensor technology and software that is transforming the manufacturing industry.

The Hardware Engineering Intern will take on a broad range of duties, which can include:

  • Creating & revising 3D models and 2D manufacturing drawings in SolidWorks
  • Creating schematic drawings and circuit board layouts in KiCAD or Cadence
  • Capturing and analyzing data on manufacturing process workflows, timings, material consumption, defect / turnback rates, etc. in support of ongoing Quality Assurance activities
  • Performing laboratory experiments on optical, mechanical, & electronic subsystems of new laser process monitoring products
  • Assisting with product safety & regulatory compliance assessments
  • Developing procedures, forms, and workflows for product assembly and test operations
Qualifications

This 16-month internship is open to students currently in their 3rd year of a 4-year university program in engineering at a CEAB-accredited institution. Suitable programs include: engineering physics, electronics engineering, mechatronics engineering, manufacturing engineering, and optical engineering.
Prior experience working with electronic and electromechanical systems at a hardware level is essential.
Prior experience writing software is not essential, but may be an asset.
All candidates are expected to be proficient in standard office software (MS 365) and be able to operate independently, under the guidance of senior engineers, without hour-to-hour supervision. 
Candidates must be thoroughly fluent in written and spoken English. Proficiency in any other language from this list is not essential, but may be an asset: Spanish, Japanese, Korean, Chinese, German, Italian, French, Polish.

Key Skills
SolidWorksKiCADCadenceData AnalysisLaboratory ExperimentsOptical SubsystemsMechanical SubsystemsElectronic SubsystemsProduct SafetyRegulatory ComplianceProcedure DevelopmentWorkflow DevelopmentMS 365
Categories
EngineeringManufacturingScience & Research