INTERNSHIP DETAILS

NPI Engineering Intern -  Advanced Package Technology

CompanyASM
LocationHsinchu
Work ModeOn Site
PostedApril 23, 2026
Internship Information
Core Responsibilities
The intern will conduct a systematic review of academic and industry research to build a structured technical knowledge base on advanced package technologies. They will synthesize fragmented information to identify key trends, process concepts, and development bottlenecks to support R&D discussions.
Internship Type
full time
Company Size
1
Visa Sponsorship
No
Language
English
Working Hours
40 hours
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About The Company
ASM International N.V. is a consumer electronics company based out of ALMERE, Netherlands.
About the Role

 

Step into a career with ASM, where cutting edge technology meets collaborative culture. ​

For over 55 years ASM has been ahead of what’s next, at the forefront of innovation and what’s technologically possible. With more than 4,500 ASMers representing 70 nationalities, our people and our advanced semiconductor devices are playing a crucial role in trends such as 5G, cloud computing, AI, and autonomous driving.  But we’re more than just a tech company. We value diversity, inclusion and sustainability as we strive to make a positive impact on the world.  Our development programs help support your growth, shaping your future and pushing the boundaries of innovation to unleash potential.  

Job's mission

We are seeking a highly motivated Engineering Intern to support early‑stage research and evaluation of advanced package technology.

This internship focuses on technology surveying, literature analysis, and knowledge synthesis. The intern will conduct a structured review of academic and publicly available industry research to develop a clear, well‑organized overview of the current Package development landscape. The results will support technical discussions and future exploratory R&D work.

This role is ideal for PhD students with a strong background in semiconductor package process, like 3DIC or 2.5D integration, or related research fields who are interested in advanced package beyond the state of the art.

 

What you will be working on

  • Conduct a systematic review of package‑related information from: 
  • Academic journals and conference proceedings
  • Patents and publicly available industry sources
  • Organize and synthesize fragmented information into a structured technical knowledge base
  • Identify key technological trends, including: 
  • Process concepts and material approaches
  • Integration strategies and reported demonstrations
  • Performance targets and extendibility considerations
  • Analyze and summarize major technical challenges and development bottlenecks identified in literature
  • Perform a high‑level scan of early industry and ecosystem signals, such as patents or collaborations
  • Prepare clear documentation and presentations that distinguish evidence‑based insights from areas of uncertainty

 

Deliverables

  • A consolidated and well‑structured technology review report on 3DIC
  • Structured summaries of technical trends and key challenges
  • Presentation materials suitable for technical discussions and evaluations

 

What You Will Gain

  • Hands‑on experience evaluating an early‑stage, next‑generation semiconductor package technology
  • Exposure to how advanced technology concepts are assessed prior to major R&D investment
  • Opportunity to develop strong skills in technical analysis, literature review, and technology scouting
  • Experience working closely with senior engineers and researchers in advanced technology development

 

What we are looking for

  • Currently pursuing a PhD degree in Electrical Engineering, Materials Science, Physics, Semiconductor Engineering, or a related field
  • Fundamental understanding of semiconductor package and/or process integration
  • Strong ability to read, analyze, and synthesize technical literature
  • Solid written communication skills in English 

 

Apply today to be part of what’s next.

We make the tech that enables the chips in devices which improve lives around the world. We do this with an eye to the future, pushing the boundaries of what’s possible through cutting-edge innovation, and driving the next wave of technological breakthroughs that shape how we live, work, and connect.

To learn more about ASM, find us at asm.com and on LinkedIn, Facebook, Instagram, X and YouTube.

ASM is an equal opportunity employer and considers qualified applicants for employment without regard to race, color, religion, age, nationality, social or ethnic origin, sexual orientation, gender, gender identify or expression, marital status, pregnancy, political affiliation, disability, genetic information, veteran status, or any other characteristic protected by law.

Key Skills
Semiconductor packaging3DIC2.5D integrationTechnical analysisLiterature reviewTechnology scoutingProcess integrationResearch synthesisData analysisTechnical documentationPresentation skillsMaterials scienceElectrical engineeringPhysics
Categories
EngineeringScience & ResearchTechnologyManufacturing