INTERNSHIP DETAILS

Mechanical and Thermal Analysis of Advanced Packaged Devices Intern

CompanyAdvanced Micro Devices, Inc
LocationSingapore
Work ModeOn Site
PostedApril 27, 2026
Internship Information
Core Responsibilities
The intern will design and execute experiments to evaluate the mechanical and thermal performance of advanced semiconductor packages. They will also analyze experimental data and collaborate with cross-functional teams to contribute to robust packaging solutions.
Internship Type
unavailable
Company Size
65255
Visa Sponsorship
No
Language
English
Working Hours
40 hours
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About The Company
We care deeply about transforming lives with AMD technology to enrich our industry, our communities, and the world. Our mission is to build great products that accelerate next-generation computing experiences – the building blocks for the data center, artificial intelligence, PCs, gaming and embedded. Underpinning our mission is the AMD culture. We push the limits of innovation to solve the world’s most important challenges. We strive for execution excellence while being direct, humble, collaborative, and inclusive of diverse perspectives. AMD together we advance_
About the Role



As an AMD [intern/co-op], you’ll be placed at the epicenter of the AI ecosystem, working alongside experts and industry pioneers. You’ll do important work, learn new skills, expand your network, and gain real-world experience on projects that impact millions of end-users worldwide. Whether you’re an undergrad or a PhD student, your contributions matter—and your experience here will be a launchpad for what comes next.

 

LOCATION: Singapore
CRITERIA: Current students studying in Universities which are based in Singapore
INTERNSHIP DURATION: The internship will begin on either 4 May 2026 or 20 July 2026, and will end on 4 Dec 2026. There is an option to extend the internship, with the extended period concluding on a fixed date of 18 Dec 2026.
 
Intern- Mechanical and Thermal Analysis of Advanced Packaged Devices
 
WHAT YOU CAN EXPECT TO LEARN:
  • Hands-on experience with mechanical and thermal analysis techniques applied to advanced semiconductor packages.
  • Practical skills in designing experiments, collecting and analyzing data using tools like MATLAB and Python.
  • Exposure to cross-functional collaboration in a high-tech R&D environment.
  • Insights into the challenges and innovations in advanced packaging technologies.
  • Professional development through technical presentations and documentation.
PROJECT OVERVIEW:
This internship focuses on evaluating the mechanical and thermal performance of advanced packaged semiconductor devices. The intern will work closely with engineering teams to design experiments, analyze results, and contribute to the development of robust packaging solutions. The project supports the growth of the Advanced Packaging Lab in Singapore and aims to enhance understanding of package reliability and performance.
 
KEY RESPONSIBILITIES:
  • Design and execute experiments to assess mechanical and thermal characteristics of semiconductor packages.
  • Analyze experimental data using MATLAB, Python, Excel, or other relevant tools.
  • Collaborate with cross-functional teams to optimize experimental setups and ensure data accuracy.
  • Present findings to internal stakeholders and participate in technical discussions.
  • Continuously refine experimental procedures and maintain clear documentation.
WHO ARE WE LOOKING FOR:
A self-driven individual that is resourceful, passionate about running experiments and
analysing data. Able to work independently, has a good work attitude and willing to learn.
Should have good communication and presentation skills.
 
RELEVANT SKILLSETS:
  • Pursuing or graduating within a year with an advanced degree (Master’s or PhD) in Materials Science, Mechanical Engineering, Electrical Engineering, or a related field.
  • Strong analytical skills and experience with data analysis tools (e.g., MATLAB, Python, Excel).
  • Familiarity with thermal and mechanical characterization techniques is a plus.
  • Excellent communication and presentation skills.
  • Ability to work independently and in a team-oriented environment.
ACADEMIC CREDENTIALS:
  • Electrical Engineering, Materials Science, or Materials Engineering preferred.
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Key Skills
Mechanical AnalysisThermal AnalysisSemiconductor PackagingMATLABPythonData AnalysisExperimental DesignMaterials ScienceMechanical EngineeringElectrical EngineeringTechnical DocumentationCross-functional CollaborationReliability TestingResearch and Development
Categories
EngineeringTechnologyScience & ResearchManufacturing