INTERNSHIP DETAILS

Engineering Student Internship (IR&D)

Company3D Glass Solutions, Inc-
LocationAlbuquerque
Work ModeOn Site
PostedApril 8, 2026
Internship Information
Core Responsibilities
The intern will work on special projects involving electronic packaging and microfabrication while following safety procedures. Responsibilities include performing engineering-centric tasks across various stages of the manufacturing process.
Internship Type
seasonal
Company Size
56
Visa Sponsorship
No
Language
English
Working Hours
20 hours
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About The Company
3D Glass Solutions, Inc. (3DGS) is a private late-stage high-tech manufacturing business headquartered in Albuquerque, New Mexico.  3DGS’ main operations are focused on the fabrication of electronic system and devices using photo-definable glass-ceramics.  3DGS manufactures a wide variety of glass-based system-in-package (SiP) devices and components using its patented low-loss photosensitive APEX® Glass technology for applications in radio-frequency (RF) electronics, photonics, automotive radar, integrated circuit (IC) electronics, medical, aerospace, defense, wireless infrastructure, mobile handset, and Internet of Things (IOT) industries.  3DGS has created foundational patent positions related to all photo-sensitive glass-ceramic materials and devices.  3DGS owns the fundamental intellectual property (IP) for all four positions (materials, design, systems, & manufacturing) related to glass-ceramic devices for the electronics packaging industry.  3DGS leverages its unique product solutions providing device manufacturing and systems integration services for a number of standard and custom products.  We provide our customers complete glass-enabled systems integration services.  Our aim is to provide our customers with an integrative solution in RF electronics and IC packaging that allows them to integrate more components onto a single platform while decreasing overall manufacturing costs. 
About the Role

Job/Position Summary

As a Student Intern you will work on special projects which align with your course objectives and studies. The goals of 3DGS’ internship program is to provide mentorship to undergraduate and graduate students in the area of electronic packaging, advanced microfabrication, data analysis, and problem solving.  This position is typically 20 hours or more a week. Internships are typically three months and can occur at any time throughout the year, depending upon the student’s educational schedule.

 

Primary Responsibilities

  • Follow all safety procedures and guidelines.
  • Perform various engineering-centric tasks at various locations throughout the manufacturing process
  • Perform additional functions and other duties as assigned or required. 

 

Requirements

  • Currently registered in an Engineering Program
  • Completed at least four semesters
  • This position will require lawful access to ITAR/EAR controlled information, and employees in these roles will need to meet those requirements. Requirements include US Citizenship, US Permanent Resident, or the ability to meet contract-specific licensure requirements.

 

Physical/Working Requirements

  • Must be able to wear personal protective gear most of the day (where applicable)
  • Prolonged periods of sitting or standing

 

Behavioral Traits

  • Strong verbal and written communication skills to convey quality standards, expectations, and feedback clearly to team members and stakeholders.
  • A willingness to adjust to changing circumstances, processes, or technologies for continuous improvement in dynamic environments.
  • The ability to work well with others, fostering a cooperative atmosphere, driving data management initiatives, and engaging all levels of the organization.


As an Intern, you will not be entitled to Company benefits (Health, Dental, Vision, IRA). Interns who work 30 hours or more per week are eligible to receive 1 hour of sick leave (2 hours per pay period), per the New Mexico Sick Leave Law.

Key Skills
Electronic PackagingAdvanced MicrofabricationData AnalysisProblem SolvingVerbal CommunicationWritten CommunicationData Management
Categories
EngineeringManufacturingScience & Research
Benefits
Sick Leave