INTERNSHIP DETAILS

Advanced Packaging Intern

CompanyMarvell Technology
LocationBengaluru
Work ModeOn Site
PostedOctober 26, 2026
Internship Information
Core Responsibilities
The intern will contribute to the advanced packaging organization by developing next-generation connectivity and compute products. Responsibilities include collaborating with cross-functional teams on package design, electrical performance, and system co-design.
Internship Type
full time
Company Size
11630
Visa Sponsorship
No
Language
English
Working Hours
40 hours
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About The Company
We believe that infrastructure powers progress. That execution is as essential as innovation. That better collaboration builds better technology. At Marvell, we go all in with you. Focused and determined, we unite behind your goals as our own. We leverage our unrivaled portfolio of infrastructure technology to identify the best solution for your unique needs. And we sit shoulder-to-shoulder with your teams to build it. Agile in our thinking, and our partnerships, we look for unexpected connections that deliver a competitive edge and reveal new opportunities. At Marvell, we’re driven by the belief that how we do things matters just as much as what we do. Because, with a foundation built on partnership, anything is possible.
About the Role

About Marvell

Marvell’s semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, and carrier architectures, our innovative technology is enabling new possibilities. 

At Marvell, you can affect the arc of individual lives, lift the trajectory of entire industries, and fuel the transformative potential of tomorrow. For those looking to make their mark on purposeful and enduring innovation, above and beyond fleeting trends, Marvell is a place to thrive, learn, and lead. 

Your Team, Your Impact

.About Marvell
Marvell’s semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, andcarrier architectures, our innovative technology is enabling new possibilities.
At Marvell, you can affect the arc of individual lives, lift the trajectory of entire industries, and fuel the transformative potential of tomorrow. For thoselooking to make their mark on purposeful and enduring innovation, above and beyond fleeting trends, Marvell is a place to thrive, learn, and lead.
Your Team, Your Impact
Marvell’s semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, andcarrier architectures, Marvell’s innovative technologies enable new possibilities and power the next generation of performance driven systems.
Within this ecosystem, Marvell’s central advanced packaging organization plays a critical role in delivering next generation connectivity and computeproducts. The organization brings deep expertise in architecture, package design, and electrical performance, including SI/PI to develop advanced IC packages that support high speed interfaces. This work directly shapes product performance, reliability, and time to market, making it a key contributor to Marvell’s overall technology leadership.

What You Can Expect

.Strong foundational understanding of package design, including design rules, breakout, place and route, signal shielding, reference planes, powerdistribution, and pinout optimization across package and system requirements.

Solid grasp of SI/PI fundamentals at the substrate, board, and system levels; familiarity with running and interpreting signal and power simulations isa plus.

Knowledge of 2D, 2.5D, and emerging packaging architectures such as CoWoS‑S/R/L, EMIB, CPO, and CPC.

High‑level understanding of thermal and mechanical package constraints (e.g., warpage, TIM).

Experience contributing to tool, process, and flow development, including library maintenance and basic scripting for automation.

Familiarity with foundry design rules and substrate manufacturing constraints.

Demonstrated ability to work across cross‑functional teams and global time zones; strong interpersonal skills and willingness to learn.

Experience collaborating with chip and board design and electrical simulation teams to optimize package and system co‑design.

Experience collaborating with chip and board design, and electrical simulation teams for co‑design and optimization.

Strong communication, presentation, and documentation skills.

What We're Looking For

Approved Intern for 2027 Calendar Year



Additional Compensation and Benefit Elements

With competitive compensation and great benefits, you will enjoy our workstyle within an environment of shared collaboration, transparency, and inclusivity. We’re dedicated to giving our people the tools and resources they need to succeed in doing work that matters, and to grow and develop with us. For additional information on what it’s like to work at Marvell, visit our Careers page.

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, national origin, sexual orientation, gender identity, disability or protected veteran status.

Interview Integrity 

To support fair and authentic hiring practices, candidates are not permitted to use AI tools (such as transcription apps, real-time answer generators like ChatGPT or Copilot, or automated note-taking bots) during interviews.

These tools must not be used to record, assist with, or enhance responses in any way. Our interviews are designed to evaluate your individual experience, thought process, and communication skills in real time. Use of AI tools without prior instruction from the interviewer will result in disqualification from the hiring process.

This position may require access to technology and/or software subject to U.S. export control laws and regulations, including the Export Administration Regulations (EAR). As such, applicants must be eligible to access export-controlled information as defined under applicable law. Marvell may be required to obtain export licensing approval from the U.S. Department of Commerce and/or the U.S. Department of State. Except for U.S. citizens, lawful permanent residents, or protected individuals as defined by 8 U.S.C. 1324b(a)(3), all applicants may be subject to an export license review process prior to employment.

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Key Skills
Package designSignal integrityPower integrityCoWoSEMIBCPOCPCThermal constraintsMechanical constraintsScriptingAutomationSubstrate manufacturingSystem co-designCommunication skillsPresentation skillsDocumentation
Categories
EngineeringTechnologyManufacturing
Benefits
Competitive compensation