INTERNSHIP DETAILS

Intern - Design Engineering

CompanyCadence Design Systems
LocationShanghai
Work ModeOn Site
PostedNovember 5, 2026
Internship Information
Core Responsibilities
The intern will focus on high-speed digital IP physical implementation and develop scripts to enhance the design flow. They will also participate in product projects to solve design issues and optimize PPA methodologies.
Internship Type
full time
Company Size
11887
Visa Sponsorship
No
Language
English
Working Hours
24 hours
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About The Company
Cadence is a market leader in AI and digital twins, pioneering the application of computational software to accelerate innovation in the engineering design of silicon to systems. Our design solutions, based on Cadence’s Intelligent System Design™ strategy, are essential for the world’s leading semiconductor and systems companies to build their next-generation products from chips to full electromechanical systems that serve a wide range of markets, including hyperscale computing, mobile communications, automotive, aerospace, industrial, life sciences and robotics. In 2024, Cadence was recognized by the Wall Street Journal as one of the world’s top 100 best-managed companies. Cadence solutions offer limitless opportunities—learn more at www.cadence.com.
About the Role

At Cadence, we hire and develop leaders and innovators who want to make an impact on the world of technology.

About the team:
Our team deliver many high-performance products based on the industry’s advanced technology with high frequencies up to 6400MHz. Our product processes include TSMC 3nm/5nm/7nm/12nm and Samsung 4nm/5nm/7nm/8nm/10nm, etc. In the team you will face great challenges such as FP, CTS, STA, etc. At the same time, you will get rich experience and advanced methodology.
Focus on high speed digital DDR and HBM/UCIe/PCIe/eUSB IPs physical implementation, develop necessary scripts or tools to enhance current PD design flow. Work in product projects, including but not limited to: complete the project tasks; solve design issue and provide flow to check and avoid similar issue; analyze and summarize PPA optimization methodologies and results, implement optimal design parameters and flows for different projects.


实习 - 数字后端工程师 (工作地点:上海)

职位描述:
(1)芯片物理设计, 后端布局布线,STA,物理验证等。
(2)团队合作,负责电路后端设计及交付,设计质量和进度控制

职位需求:
(1)微电子,电子工程硕士以上学历
(2)较强的问题分析以及团队合作能力
(3)较强的中英文口语沟通及写作能力
(4)熟悉数字后端工具
(5)积极主动, 有责任心

**每周可以工作至少3天,实习期6-8个月

We’re doing work that matters. Help us solve what others can’t.

Key Skills
Physical DesignFloorplanningCTSSTAPhysical VerificationDigital BackendScriptingPPA OptimizationDDRHBMUCIePCIeeUSBMicroelectronicsElectronic EngineeringTeamwork
Categories
EngineeringTechnologySoftware